News
Low-Noise High-Speed JFET-Input Op Amps.
OX3 can supply semiconductors in addition to packaging them.
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Providing packaging for the Ultra-Reliable LQFP from NXP Semiconductors.
The package outline, HLQFP176 comes in a plastic, thermal enhanced low-profile quad flat leaded package.
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Tailor-made Packaging: Assisting a client with their stock of a Kyocera power supply.
Kyocera CP Series tantalum modules in packaging would not conform to needs on the production floor. Our client called on OX3 to mend the gap.
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Switching a Samtec Connector from Tube to Tape
We were approached by a client with a request to repackage Samtec connectors from tube to carrier tape.
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Our Successful D2Pak Case Study
One of our clients was looking for IC tubes to fit the package D2PAK or TO-263.
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REEL.biz - Where Industry Turns for Top-Quality Semiconductor Reels and More!
At OX3, we understand the importance of efficient and reliable supply chain solutions in the semiconductor industry. REEL.biz is your ultimate destination for all things semiconductor-related. We understand the importance...
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OX3’S 4S PLAN
Simplification: Early on, we ascertained that just the sheer volume of electronic devices and the materials to package them is intimidating and confusing to the typical industrial buyer. We devoted...
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RADIAL TAPING & REELING
This technology evolved in the 1970´s, but is still quite popular today for LED´s, TO-92´s and many classes of capacitor. Lead diameters and body case sizes vary greatly. Because of...
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NEW ORDERING CATALOG
The first edition of Orion’s newest catalog showcasing some of its newest equipment and materials hit the streets in October last year. Attractive pricing and premium service options have made...
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OX3 AWARDED $100,000 AVX CONTRACT
OX3 Corporation President Gus G. Widmayer announced today that AVX Corp awarded his company a $100,000 contract in 2013 for semiconductor packaging. AVX is a leading worldwide manufacturer and supplier...
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RAYTHEON AWARDS $48,000 CONTRACT TO OX3
Raytheon Company, (RTN), has awarded a $48,000 contract to OX3 for baking and packaging of electronic parts and sub-assemblies. Raytheon’s Integrated Defense Systems subsidiary “provides equipment to an international and...
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